原文摘录：Samsung Electronics, Samsung C&T, Samsung SDS, Samsung SDI, Samsung Life Insurance and Samsung Fire & Marine Insurance today announced they are investing a combined USD 1 billion in Helix Digital Infrastructure, an AI infrastructure compan…
三星电子宣布与Mistral AI达成战略合作，将在半导体业务中引入Mistral AI服务及旗舰大语言模型Mistral Large，开发定制化本地部署AI模型。三星还将把针对性AI模型应用于缺陷检测和设备优化，以加速先进存储与逻辑芯片的开发周期、制造精度和良率稳定。三星同时领投了Mistral AI的D轮融资，获得战略股权以支持长期技术合作。
原文摘录：Samsung Electronics and ASML today announced an expansion of their long-standing strategic partnership, deepening collaboration on High NA EUV lithography and advanced semiconductor manufacturing technologies that will help drive the next…
原文摘录：Samsung Electronics a global leader in advanced memory technology, today unveiled the P9 and P7, its next-generation portable solid-state drives (SSDs) featuring USB4 connectivity. The company introduced the new P Series at Gamescom 2026,…
原文摘录：Samsung Electronics, a global leader in advanced memory technology, today showcased its latest AI memory innovations at Future of Memory and Storage (FMS) 2026 in Santa Clara, California. With broad expertise spanning DRAM, NAND, enterpris…
原文摘录：Samsung Electronics and Broadcom today announced the signing of a memorandum of understanding (MOU) to expand their strategic collaboration across memory and foundry technologies, supporting the next generation of AI infrastructure. The MO…
原文摘录：UPDATE: 2026.07.17 Information TOKYO and SAN JOSE, Calif., July 16, 2026 —Rapidus Corporation and Cadence (Nasdaq: CDNS) today announced a collaboration to advance agentic AI for advanced-node system-on-chip (SoC) design by integrating the…
原文摘录：Samsung Electronics a global leader in advanced memory technology, today announced mass production of PM1763, the company’s PCIe® 6.0-based enterprise solid state drive (SSD) optimized for next-generation AI and HPC server environments. As…
原文摘录：Samsung Electronics, the world leader in advanced memory technology today announced that, for the first time in the industry, it has developed the industry’s fastest Universal Flash Storage (UFS) 5.0 solution, which will help enable seamle…
Rapidus于6月16日宣布与意大利半导体设计基金会Fondazione Chips-IT签署谅解备忘录，为日本政府与意大利之间的合作提供框架。日本首相Sanae Takaichi于6月15日访意与意大利总理Giorgia Meloni会面推进双边科技合作，该备忘录为此倡议的一部分。Rapidus目前正进行试产，目标2027年在日本量产尖端2nm逻辑半导体。
原文摘录：UPDATE: 2026.06.15 Information TOKYO, June 15, 2026 – Rapidus Corporation today announced that it signed a Memorandum of Understanding (MoU) with the UK Semiconductor Centre (UKSC), a national body promoting the semiconductor industry in t…
三星电子宣布已开始向主要全球客户出货业界首款12层HBM4E样品，并计划在样品出货和优化后按客户时间表启动量产。该产品引脚速度稳定为14Gbps、可扩展至16Gbps，较HBM4提升逾20%，单堆栈带宽最高3.6TB/s，12层容量48GB、较上一代增加逾30%，并计划按客户需求扩展32GB（8层）和64GB（16层）配置。
推荐理由：三星披露HBM4E样品出货及速度、容量、能效等参数，可观察下一代HBM产品阶段与量产节奏。
原文摘录：UPDATE: 2026.04.11 Information TOKYO, April 11 2026 – Rapidus Corporation today announced that it opened an Analysis Center and its Rapidus Chiplet Solutions (RCS). The Analysis Center is a facility adjacent to Rapidus’ Innovative Integrat…
原文摘录：UPDATE: 2026.04.11 Information TOKYO, April 11, 2026 – Rapidus Corporation today announced that its plans and budget for fiscal year 2026 have been approved by Japan‘s New Energy and Industrial Technology Development Organization (NEDO). T…
三星电子宣布与AMD签署谅解备忘录，扩大在下一代AI存储与计算技术上的战略合作。根据备忘录，双方将就下一代AMD AI加速器Instinct MI455X GPU的主要HBM4供应，以及代号“Venice”的第6代AMD EPYC CPU所用先进DRAM方案进行对接。
推荐理由：三星与AMD签署谅解备忘录，明确HBM4与DDR5供应方向并提及代工合作讨论，可观察AI存储供应链的绑定进展与阶段约束。
原文摘录：Samsung Electronics, a global leader in advanced semiconductor technology, today announced the comprehensive AI computing technologies it will showcase at NVIDIA GTC 2026 in San Jose, California, scheduled for March 16-19. As the industry’…
原文摘录：Samsung Electronics, a global leader in advanced memory technology, today announced that it has begun mass production of its industry-leading HBM4 and has shipped commercial products to customers. This achievement marks a first in the indu…
原文摘录：Samsung Electronics today announced plans to create a new AI Megafactory in collaboration with NVIDIA, marking a major milestone in the company’s efforts to lead the global paradigm shift toward AI-driven manufacturing. By deploying more t…
三星电子宣布在其器兴园区为新半导体研发综合体NRD-K举行设备搬入仪式，该综合体2022年动工，将作为存储、System LSI和晶圆代工研发基地。三星计划到2030年为此投资约20万亿韩元，占地约10.9万平方米，其中研发专用产线计划于2025年年中开始运营。
推荐理由：三星披露其新建半导体研发综合体NRD-K的设备搬入节点、投资规模与专用产线投运时间，可用于跟踪其下一代存储与代工研发节奏。
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced it has developed the industry’s first 24-gigabit (Gb) GDDR71 DRAM. In addition to the industry’s highest capacity, the GDDR7 features the fastest speed, p…
三星电子宣布已开始量产PM9E1，这是一款采用自研5纳米控制器和第八代V-NAND的PCIe 5.0 SSD，顺序读写速度分别达14.5GB/s和13GB/s，较上代提升逾一倍。该产品提供512GB至4TB容量选项，功耗效率提升超50%，并应用SPDM v1.2安全技术。三星计划以PM9E1为起点向全球PC厂商扩展先进SSD供应。
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced the release of the 990 EVO Plus, adding to its lineup of leading SSD products. With PCIe 4.0 support and latest NAND technology, the 990 EVO Plus is an id…
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced it has begun mass production of its one-terabit (Tb) quad-level cell (QLC) 9th-generation vertical NAND (V-NAND). With the industry’s first mass productio…
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced it has begun mass production for the industry’s thinnest 12 nanometer (nm)-class, 12-gigabyte (GB) and 16GB LPDDR5X DRAM packages, solidifying its leaders…
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced the release of its 1-terabyte (TB) high-capacity microSD cards PRO Plus and EVO Plus. By adopting Samsung’s eighth-generation V-NAND (V8) technology, the…
三星电子宣布已完成业界最快10.7Gbps LPDDR5X DRAM的验证，该产品将用于联发科下一代Dimensity平台。此次验证基于三星LPDDR5X 16GB封装，在联发科即将发布的旗舰Dimensity 9400 SoC上完成，双方在三个月内完成合作验证。三星称该LPDDR5X功耗和性能较上代提升超25%，可延长移动设备续航并增强端侧AI性能。
三星电子发布ISOCELL HP9、GNJ和JN5三款面向智能手机主摄与副摄的图像传感器。其中HP9为业界首款2亿像素长焦传感器，采用1/1.4英寸光学格式，光敏度较前代提升12%、自动对焦对比度提升10%。GNJ为5000万像素双像素传感器，4K 60fps视频模式下功耗较前代改善34%。
原文摘录：Samsung Electronics, a world leader in advanced semiconductor technology, today unveiled its latest foundry innovations and outlined its vision for the AI era during Samsung Foundry Forum (SFF) U.S., an annual event held at the company’s D…
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), solidifying its leadership in th…
原文摘录：Samsung Electronics, a world leader in advanced memory technology, today announced that it has developed the industry’s first LPDDR5X DRAM supporting the industry’s highest performance of up to 10.7 gigabits-per-second (Gbps). Leveraging 1…
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced that it has started sampling its 256-gigabyte (GB)1 SD Express2 microSD card with sequential read speed of up to 800 megabytes per second (MB/s) and has c…
原文摘录：Samsung Electronics, a world leader in advanced memory technology, today announced that it has developed HBM3E 12H, the industry’s first 12-stack HBM3E DRAM and the highest-capacity HBM product to date. Samsung’s HBM3E 12H provides an all-…
原文摘录：Samsung Electronics, a world leader in advanced memory technology, today announced the release of SSD 990 EVO — the newest addition to the company’s lineup of consumer SSDs — which delivers powerful performance with better energy efficienc…
原文摘录：Samsung Electronics, a world leader in advanced semiconductor technology, today introduced two new ISOCELL Vizion sensors — a time-of-flight (ToF) sensor, the ISOCELL Vizion 63D and a global shutter sensor, the ISOCELL Vizion 931. First in…
原文摘录：Samsung Electronics, a world leader in advanced semiconductor technology, today unveiled the T5 EVO, a lightweight portable Solid-State Drive (SSD) that provides up to 8 terabytes (TB) of capacity, which is the largest capacity size curren…
原文摘录：Samsung Electronics today opened the Samsung AI Forum, at which it shared the latest research achievements in artificial intelligence (AI) and computer engineering (CE), contributing to enhancing the company’s next-generation semiconductor…
原文摘录：Samsung Electronics, a world leader in advanced memory technology, today held its annual Memory Tech Day, showcasing industry-first innovations and new memory products to accelerate technological advancements across future applications — i…
原文摘录：Samsung Electronics, a world leader in advanced semiconductor technology, today unveiled its latest innovations in analog and logic semiconductor technologies and outlined its blueprint for upcoming technological advancements at its inaugu…
原文摘录：Samsung Electronics, a world leader in advanced memory technology, today announced that it has developed the industry’s first Low Power Compression Attached Memory Module (LPCAMM) form factor, which is expected to transform the DRAM1 marke…
原文摘录：Samsung Electronics, a world leader in advanced memory technology, today announced the release of a new 4-terabyte (TB) offering in its SSD 990 PRO series. The 990 PRO series is a lineup of high-performance PCIe1 4.0 SSDs powered by Samsun…