原文摘录：Tokyo Electron Technology Solutions Fujii Head Office and Hosaka Office (Yamanashi Prefecture, Japan) have earned Platinum Status, the highest recognition available, under the Responsible Business Alliance (RBA) * Validated Assessment Prog…
原文摘录：UPDATE: 2026.10.26 Information TOKYO and NOIDA, India, Oct. 26, 2026: HCLTech , a leading global technology company, and Rapidus Corporation , a Japanese company developing and manufacturing advanced logic semiconductors, today officially…
据东方财富研究中心，JSR、东京应化、信越化学自2026年10月1日起对全球客户执行新定价体系，全品类新订单基础涨幅15%，高端ArF长协上调16%–22%，HBM专用浸没式ArF最高上调24%，现货散单涨幅32%–38%。
10月16日，日韩股市集体高开，韩国KOSPI指数开盘上涨1.8%报5652.65点，SK海力士、三星电子均涨超2%；日经225指数涨幅扩大至1%。前一日韩国股市遭遇剧烈抛售、两大股指同日触发熔断，韩国金融监管机构当日下午召开紧急会议并发布官方声明，要求采取应对措施保障市场稳定，并称近期跌幅和资金流出可能已出现过度反应。
受人工智能投资风险担忧加剧等因素影响，日本东京股市日经指数15日收盘报64425.95点，较前一交易日下挫3318.34点，跌幅4.90%，创今年3月以来最大单日跌幅。前一交易日美国纽约股市三大股指全线下跌，美国9月消费者价格指数涨幅高于市场预期，市场对美联储加息预期升温，人工智能和半导体相关股票遭抛售。爱德万测试、东京电子等日本半导体设备企业股价下跌，拖累日经股指。
10月15日日韩股市双双暴跌，日经225指数跌4.9%，韩国综合指数重挫逾7%盘中触发熔断；A股主要指数全线收跌，上证指数盘中一度跌破3700点，全市场超5100只个股下跌。大金融午后集体护盘，券商股率先拉升，华林证券（002945）强势涨停，锦龙股份、交通银行、中国平安等逆市上涨。华安证券指出，市场震荡收敛过程预计还将持续半个月左右，结束后年内还将出现一波持续1个月左右的行情。
截至10月15日，日经225指数跌幅扩大至3%，半导体相关板块承压。日本存储芯片巨头铠侠（Kioxia）股价下跌超过8%，拖累整体市场情绪。
原文摘录：TEL Manufacturing and Engineering of America (Chaska, Minnesota, U.S.A.) has earned Platinum Status, the highest recognition available under the Responsible Business Alliance (RBA)* Validated Assessment Program (VAP), with a perfect score…
东京商工调查公司8日数据显示，2026财年上半年日本负债1000万日元以上企业破产5373家，同比增3.8%，创2013财年以来新高，负债总额约8561.69亿日元，同比增23.5%。帝国数据银行称今年1~8月已有112家百年企业破产，按当前速度全年或超160家，打破2024年146家的纪录。成本上涨、人手不足及日本央行加息至约1.25%带来的融资压力，成为中小企业核心难题。
10月5日，日本股市开盘走高，日经225指数涨超2%，最新报69751.16点，创近三个月新高，东证指数涨超1%至4135.40点。电子、机械板块领涨，东京电子、爱德万测试均涨超3%，存储巨头铠侠高开后快速跳水，截至发稿下跌0.65%。消息面上，OpenAI首席执行官山姆·奥特曼在AI风险问题上与Anthropic立场出现分歧，称不认同AI存在“极高毁灭性风险”。
原文摘录：UPDATE: 2026.10.05 Information TOKYO, Oct. 5, 2026 – Rapidus Corporation today announced that it will establish the Rapidus Collaborative Open Rapid Ecosystem (CORE), a global ecosystem framework to support the development and mass product…
原文摘录：UPDATE: 2026.07.17 Information TOKYO and SAN JOSE, Calif., July 16, 2026 —Rapidus Corporation and Cadence (Nasdaq: CDNS) today announced a collaboration to advance agentic AI for advanced-node system-on-chip (SoC) design by integrating the…
原文摘录：As part of the development of Agentic AI and Robotics solutions, Tokyo Electron(TEL; Head Office: Minato-ku, Tokyo; President: Toshiki Kawai) is collaborating with NVIDIA, utilizing NVIDIA Agent Toolkit including NVIDIA NeMo, NVIDIA NIM, N…
原文摘录：UPDATE: 2026.06.15 Information TOKYO, June 15, 2026 – Rapidus Corporation today announced that it signed a Memorandum of Understanding (MoU) with the UK Semiconductor Centre (UKSC), a national body promoting the semiconductor industry in t…
原文摘录：UPDATE: 2026.04.11 Information TOKYO, April 11 2026 – Rapidus Corporation today announced that it opened an Analysis Center and its Rapidus Chiplet Solutions (RCS). The Analysis Center is a facility adjacent to Rapidus’ Innovative Integrat…
原文摘录：UPDATE: 2026.04.11 Information TOKYO, April 11, 2026 – Rapidus Corporation today announced that its plans and budget for fiscal year 2026 have been approved by Japan‘s New Energy and Industrial Technology Development Organization (NEDO). T…
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